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This paper aims to develop a method to measure the length of cracks inside solder joints, which enables the validation of computed tomography (CT) crack length measurements.

Cracks were formed inside solder joints intentionally by aging solder joints of 0603 size resistors with thermal shock (TS) test (−40 to +140°C, 2,000 cycles), and CT images were captured about them with different rotational increment (1/4, 1/2 and 1°) of sample projection. The length of cracks was also measured with our method, which is based on capturing high-resolution radiography X-ray images about the cracks in two perpendicular projection planes. The radiography results were compared to the CT measurements. The percentage error for the different CT rotational increment settings was calculated, and the optimal CT settings have been determined.

The results have proven that reducing the rotational increment increases the sharpness of the captured images and the accuracy of crack length measurements. Nevertheless, the accuracy compared to high-resolution radiography measurements is only slightly better at 1/4° rotational increment than in the case of 1/2° rotational increment. It should be also noted that the 1/4° increment requires twice as much time for capturing the images as the 1/2° increment. So, the 1/2° rotational increment of sample projection is the optimal setting in our investigated case for measuring crack lengths.

The developed method is applicable to find the optimal settings for CT crack length measurements, which provides faster analysation of large quantity samples used, e.g. at life-time tests.

There is a lack of information in the literature regarding the optimisation of CT measurement set-up, e.g. a slightly larger value of the sample rotational increment can provide acceptable resolution with much faster processing time. Thus, the authors developed a method and performed research about optimising CT measurement parameters.

The purpose of this paper is to present a novel and alternative method for the characterization of isotropic conductive adhesive (ICA) joints’ conductivity by the calculation of the mean intercept length of conductive flakes in the cured joint. ICAs are widely used in the field of hybrid electronics or special printed circuit board applications, such as temperature sensitive or flexible circuits. The main quality parameters of the ICA joints are the conductivity and the mechanical strength.

For the experiments, one-component Ag-filled thermoset ICA paste was used on FR4 printed circuit test board to join zero-ohm resistors. Six different curing temperatures were applied: 120, 150, 175, 210, 230 and 250°C. The conductivity of the joints was measured in situ during the curing process. Micrographs were taken from the cross-sectioned joints, and the mean intercept length was calculated on them after image processing steps.

Results of the measured conductivity and the mean intercept length were compared, and acceptable correlation was found for what can be used for characterizing the conductibility of ICA joints.

Investigating and characterizing the conductivity of ICA joints by an image processing method.

The main advantage of this method compared to the electrical measurements is that the conductivity characterization is possible on any kind of component. Therefore, this method can be used in any appliances not only in test circuits.

This paper aims to investigate the quality and reliability of solder joints prepared from Pb-free alloys on direct bounded Cu (DBC) substrates. Two types of solder alloys were studied: Sn90.95Ag3.8Cu0.7Sb1.4Ni0.15Bi3.0, with a high melting point of 225°C, and Sn42Bi58, with low a melting point of 138°C.

Capacitor components of size 1806 were soldered on DBC substrates by using convection reflow soldering and vacuum vapor-phase soldering technologies. A part of the samples was subjected to the thermal shock test. The structure of the solder joints and the content of the voids were investigated using three-dimensional X-ray tomography. The mechanical strength of the joints was evaluated using the shear force test, and the microstructure of the joints was studied on metallographic cross sections by using scanning electron microscopy.

It was found that the number of voids is not related directly to the mechanical strength of the solder joints. The mechanical strength of the solder joints depends more on the amount of Ag₃Sn precipitation, Au precipitation and the intermetallic layer in the solder joints. In some cases, the thermal shock test caused micro-cracks around the Au precipitation because of a mismatch of Au, AuSn₄ and Sn in terms of coefficients of thermal expansion.

DBC substrates are usually used for power electronics, where the quality of the solder joints is even more important than in the case of commercial electronics.